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Diamond Parting Wheel

Leading Manufacturer of grindtec - resin bond diamond parting wheel from Vadodara.
GrindTec - Resin Bond Diamond Parting Wheel

GrindTec - Resin Bond Diamond Parting Wheel

Price on Request

Product Details:
Usage/ApplicationDry Grinding
MaterialCarbide
Abrasive GradeDiamond
Size/DimensionDia 100, 150
Bond TypeResin
Thickness of Wheel1mm
Packaging TypeCorrugated Box
BrandGrindTec
I Deal InNew Only
Country of OriginMade in India
"GrindTec" introduces resin bond diamond parting wheel for carbide road cutting purpose

Size : Dia 100mm X Thikness 1mm X Bore 31.75mm
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